Storage & Application
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Storage & Application
Storage Method:

1. The recommended storage conditions for solder balls: 25¡Ó10¢J, relative humidity below 60%RH. Shelf life for products that are contained in sealed ESD jars and stored properly and not agitated is 12 months.
2. The temperatures and humidity of the storage environment should be the same as the application environment.
3. Reduce vibration, moisture, contamination, excessive heat or cold, and direct sunlight sources to a minimum.
4. Keep unused solder spheres in original containers with tightened inner and outer caps.
5. Solder balls yet to be used should not be exposed to air to avoid oxidization.

Application Method:

1.Retrieve only the required quantity of material for the application from the storage area to reduce agitation, uncontrolled environmental and contaminant exposure.
2. Refrain from touching the material with fingers to reduce contaminant exposure and denting.
3. Store excess material that has been exposed to production in nitrogen atmosphere cabinets.
4. Before reusing, check their suitability for application.
5. Apply only the appropriate amount of flux and paste during ball mounting.